Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
f
i
= input frequency in MHz;
f
o
= output frequency in MHz;
C
L
= output load capacitance in pF;
V
CC
= supply voltage in V;
N = number of inputs switching;
∑(C
L
×
V
CC2
×
f
o
) = sum of outputs.
4. Ordering information
Table 2:
Ordering information
Package
Temperature range Name
74HC244
74HC244N
74HC244D
74HC244DB
74HC244PW
74HC244BQ
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
DIP20
SO20
SSOP20
TSSOP20
plastic dual in-line package; 20 leads (300 mil)
plastic small outline package; 20 leads;
body width 7.5 mm
plastic shrink small outline package; 20 leads;
body width 5.3 mm
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
SOT146-1
SOT163-1
SOT339-1
SOT360-1
SOT764-1
Description
Version
Type number
DHVQFN20 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 20 terminals;
body 2.5
×
4.5
×
0.85 mm
DIP20
SO20
SSOP20
TSSOP20
plastic dual in-line package; 20 leads (300 mil)
plastic small outline package; 20 leads;
body width 7.5 mm
plastic shrink small outline package; 20 leads;
body width 5.3 mm
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
74HCT244
74HCT244N
74HCT244D
−40 °C
to +125
°C
−40 °C
to +125
°C
SOT146-1
SOT163-1
SOT339-1
SOT360-1
SOT764-1
74HCT244DB
−40 °C
to +125
°C
74HCT244PW
−40 °C
to +125
°C
74HCT244BQ
−40 °C
to +125
°C
DHVQFN20 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 20 terminals;
body 2.5
×
4.5
×
0.85 mm
74HC_HCT244_3
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 22 December 2005
2 of 22
PHILIPS [ NXP SEMICONDUCTORS ]
