BAS40 series; 1PSxxSB4x series
Philips Semiconductors
General-purpose Schottky diodes
2.65
0.75
1.30
1.325
solder lands
solder resist
occupied area
solder paste
2
0.50
(3x)
3
0.60
(3x)
2.35 0.85
1.90
1
0.55
(3x)
MSA429
2.40
Dimensions in mm
Fig 22. Reflow soldering footprint SOT323 (SC-70)
4.60
4.00
1.15
solder lands
solder resist
2
occupied area
3
3.65 2.10
2.70
0.90
(2x)
1
MSA419
preferred transport direction during soldering
Dimensions in mm
Fig 23. Wave soldering footprint SOT323 (SC-70)
BAS40_1PSXXSB4X_SER_7
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 07 — 12 May 2006
15 of 21
NXP [ NXP ]
