Phycomp
Product specification
Surface-mount ceramic
multilayer capacitors
IEC
60384-10/
CECC 32 100
CLAUSE
4.11
IEC
60068-2
TEST
METHOD
Ta
Class 2, Y5V
16/25/50 V
TEST
PROCEDURE
REQUIREMENTS
solderability
zero hour test, and test after
storage (20 to 24 months) in
original packing in normal
atmosphere;
unmounted chips completely
immersed for 2
±0.5
s in a
solder bath at 235
±5 °C
preconditioning:
between minimum and
maximum temperature, 5 cycles
initialization:
48
±4
hours after U
R
at 40 °C
for 1 hour (for initial value
measurement);
500
±12
hours at 40 °C;
90 to 95% RH; U
R
applied
initialization:
48 hours after U
R
at 40 °C;
for 1 hour (for initial value
measurement);
500
±12
hours at 40 °C;
90 to 95% RH; U
R
applied
the terminations shall be
well tinned
4.12
Na
rapid change of
temperature
damp heat,
steady state
no visible damage
after 48 hours recovery:
∆°C/C: ≤ ±20%
no visible damage
after 48 hours recovery:
∆°C/C: +30%/−40%
tan
δ: ≤15%
R
ins
: 500 MΩ or R
i
C
R
≥
100 s,
whichever is less
preconditioning:
U
R
at 40
°C
for 1 hour, after
48 hours recovery:
∆°C/C: +30%/−40%
tan
δ: ≤15%
R
ins
: 500 MΩ or R
i
C
R
≥
25 s,
whichever is less
after 48 hours recovery:
∆°C/C: +30%/−40%
tan
δ: ≤15%
R
ins
: 1000 MΩ or R
i
C
R
≥
50 s,
whichever is less
4.14
Ca
damp heat;
with U
R
load
4.15
endurance
initialization:
2
×
U
R
at 85
°C
for 1 hour,
(initial value measurement after
48
±4
hours) ;
2
×
U
R
at 85
°C
for 1000 hours
recovery 48
±4
hours at room
temperature
2003 Jul 08 Rev.7
10
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PHILIPS [ NXP SEMICONDUCTORS ]
