Phycomp
Product specification
Surface-mount ceramic
multilayer capacitors
TESTS AND REQUIREMENTS
Table 2
Test procedures and requirements
IEC
60068-2
TEST
METHOD
Class 2, Y5V
16/25/50 V
IEC
60384-10/
CECC 32 100
CLAUSE
4.4
TEST
PROCEDURE
REQUIREMENTS
mounting
the capacitors may be mounted
on printed-circuit boards or
ceramic substrates by applying
wave soldering, reflow soldering
(including vapour phase
soldering) or conductive
adhesive
any applicable method using
×10
magnification
f = 1 kHz; Y5V measuring
voltage 1 V
rms
at 25
°C
f = 1 kHz; Y5V measuring
voltage 1 V
rms
at 25
°C
at U
R
(DC) for 1 minute
2.5
×
U
R
for 1 minute
between minimum and maximum
temperature
a force of 5 N applied for 10 s to
the line joining the terminations
and in a plane parallel to the
substrate
mounted in accordance with IEC
60384-1, paragraph 4.35
conditions:
bending 1 mm at a rate of 1
mm/s, radius jig 340 mm
no visible damage
4.5
4.6.1
4.6.2
4.6.3
4.6.4
4.7.1
4.8
visual inspection and
dimension check
capacitance
tan
δ
insulation resistance
voltage proof
temperature
coefficient
adhesion
in accordance with
specification
within specified tolerance
in accordance with
specification
R
i
C
R
≥500
s
no breakdown or flashover
in accordance with
specification
no visible damage
4.9
bond strength of
plating on end face
no visible damage
∆C/C: ≤30%
4.10
Tb
resistance to
soldering heat
preconditioning:
120 to 150 °C during 1 minute;
260
±5
°C for 10
±0.5
s in a
static solder bath
260
±5 °C
for 30
±1
s
in a static solder bath
the terminations shall be
well tinned
after recovery
∆C/C: ±20%
tan
δ:
original specification
R
ins
: original specification
using visual enlargement
of
×10,
dissolution of the
terminations shall not
exceed 10%
resistance to
leaching
2003 Jul 08 Rev.7
9
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PHILIPS [ NXP SEMICONDUCTORS ]
