Package mechanical
M25PX64
11
Package mechanical
In order to meet environmental requirements, Numonyx offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
Figure 35. VDFPN8 (MLP8) 8-lead very thin dual flat package no lead,
8 × 6 mm, package outline
D
E
E2
e
b
D2
A
L
K
L1
ddd
A1
VDFPN-02
1. Drawing is not to scale.
2. The circle in the top view of the package indicates the position of pin 1.
Table 18. VDFPN8 (MLP8) 8-lead very thin dual flat package no lead,
8 × 6 mm, package mechanical data
Millimeters
Inches
Symbol
Typ
Min
Max
Typ
Min
Max
A
A1
b
0.85
1.00
0.05
0.48
0.033
0.039
0.002
0.019
0.00
0.35
0.000
0.014
0.40
8.00
5.16
0.016
0.315
0.203
D
(1)
D2
ddd
E
0.05
0.002
–
6.00
4.80
1.27
0.236
0.189
0.050
E2
e
–
–
–
K
0.82
0.45
0.032
0.018
L
0.50
0.60
0.15
0.020
0.024
0.006
L1
N
8
8
1. D2 Max must not exceed (D – K – 2 × L).
62/66
NUMONYX [ NUMONYX B.V ]
