Revision history
M25P64
13
Revision history
Table 18. Document revision history
Date
Revision
Changes
28-Apr-2003
15-May-2003
20-Jun-2003
18-Jul-2003
02-Sep-2003
0.1
0.2
0.3
0.4
0.5
Target Specification Document written in brief form
Target Specification Document written in full
8x6 MLP8 and SO16(300 mil) packages added
tPP, tSE and tBE revised
Voltage supply range changed
Table of contents, warning about exposed paddle on MLP8, and Pb-free
options added
19-Sep-2003
17-Dec-2003
15-Nov-2004
0.6
0.7
1.0
Value of tVSL(min) VWI, tPP(typ) and tBE(typ) changed. MLP8 package
removed.
Document status promoted from Target Specification to Preliminary Data.
8x6 MLP8 package added. Minor wording changes.
Deep Power-Down mode removed from datasheet (Figure 18: Read
Electronic Signature (RES) instruction sequence and data-out sequence
modified and tRES1 and tRES2 removed from Table 14: AC
characteristics). SO16 Wide package specifications updated. End timing
line of tSHQZ modified in Figure 24: Output timing. Figures moved below
the corresponding instructions in the Instructions section.
24-Feb-2005
2.0
Updated Page Program (PP) instructions in Page Programming, Page
Program (PP) and Table 14: AC characteristics.
Fast Program/Erase mode added and Power-up specified for Fast
Program/Erase mode in Power-up and Power-down section. W pin
changed to W/VPP. (see Write Protect/Enhanced Program supply voltage
(W/VPP) description). Note 2 inserted below Figure 26 Blank option
removed under Plating Technology.
23-Dec-2005
3.0
tVPPHSL added to Table 14: AC characteristics and Figure 25: VPPH timing
inserted.
All packages are ECOPACK® compliant.
Document status promoted from Preliminary Data to full Datasheet
status.
VDFPN8 (MLP8) package specifications updated (see Section 11:
Package mechanical).
16-Feb-2006
07-Sep-2006
4.0
5
Figure 4: Bus master and memory devices on the SPI bus modified.
I
CC1 maximum value updated in Table 13: DC characteristics.
48/50
NUMONYX [ NUMONYX B.V ]
