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M25P10-AVMP3P/X 参数 Datasheet PDF下载

M25P10-AVMP3P/X图片预览
型号: M25P10-AVMP3P/X
PDF下载: 下载PDF文件 查看货源
内容描述: 1兆位,串行闪存, 50MHz的SPI总线接口 [1 Mbit, serial Flash memory, 50 MHz SPI bus interface]
分类和应用: 闪存
文件页数/大小: 51 页 / 989 K
品牌: NUMONYX [ NUMONYX B.V ]
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M25P10-A  
Revision history  
13  
Revision history  
Table 25. Document revision history  
Date  
Revision  
Changes  
25-Feb-2001  
1.0  
Document written.  
VFQFPN8 package (MLP8) added. Clarification of descriptions of  
entering Standby Power mode from Deep Power-down mode, and of  
terminating an instruction sequence or data-out sequence.  
12-Sep-2002  
1.1  
Typical Page Program time improved. Write Protect setup and hold times  
specified, for applications that switch Write Protect to exit the Hardware  
Protection mode immediately before a WRSR, and to enter the Hardware  
Protection mode again immediately after.  
13-Dec-2002  
21-Feb-2003  
1.2  
1.3  
Erroneous address ranges corrected in memory organization table.  
Table of contents, warning about exposed paddle on MLP8, and Pb-free  
options added.  
24-Nov-2003  
2.0  
40 MHz AC characteristics table included as well as 25 MHz. ICC3(max),  
tSE(typ) and tBE(typ) values improved. Change of naming for VDFPN8  
package.  
Devices with Process technology Code X added (Read Identification  
(RDID) and Table 20: AC characteristics (50 MHz operation, device grade  
6)) added.  
SO8 narrow package specifications updated.  
08-Mar-2005  
3.0  
Notes 1 and 2 removed from Table 24: Ordering information scheme.  
Note 1 to Table 9: Absolute maximum ratings changed, note 2 removed  
and TLEAD values removed.  
Small text changes. End timing line of tSHQZ modified in Figure 25: Output  
timing.  
Read Identification (RDID), Deep Power-down (DP) and Release from  
Deep Power-down and Read Electronic Signature (RES) instructions,  
and Active Power, Standby Power and Deep Power-down modes  
paragraph clarified.  
01-Apr-2005  
01-Aug-2005  
4.0  
5.0  
Updated Page Program (PP) instructions in Page Programming, Page  
Program (PP) and Table 16: Instruction times (device grade 6).  
All packages are ECOPACK® compliant. Grade 3 information added (see  
Table 10, Table 11, Table 15, Table 17, Table 18 and Table 24).  
Figure 3: Bus master and memory devices on the SPI bus modified and  
Note 2 added.  
Table 11: Data retention and endurance added.  
40MHz frequency condition modified for ICC3 in Table 14: DC  
characteristics (device grade 6).  
14-Apr-2006  
6
Table 14: DC characteristics (device grade 6) shows preliminary data.  
MLP package renamed as VFQFPN and specifications updated (see  
silhouette on first page, Figure 27 and Table 22). Note 2 added below  
Figure 26 and Note 2 added below Figure 27. VWI parameter for device  
grade 3 added to Table 8: Power-up timing and VWI threshold.  
/X Process added to Table 24: Ordering information scheme.  
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