Revision history
M25P05-A
13
Revision history
Table 23. Document revision history
Date
Revision
Changes
25-Feb-2001
1.0
Initial release.
Clarification of descriptions of entering Standby Power mode from Deep
Power-down mode, and of terminating an instruction sequence or data-
out sequence.
11-Apr-2002
12-Sep-2002
1.1
1.2
VFQFPN8 package (MLP8) added.
Typical Page Program time improved. Write Protect setup and hold times
specified, for applications that switch Write Protect to exit the Hardware
Protection mode immediately before a WRSR, and to enter the Hardware
Protection mode again immediately after.
13-Dec-2002
24-Nov-2003
1.3
2
Table of contents, warning about exposed paddle on MLP8, and Pb-free
options added.
40 MHz AC characteristics table included as well as 25 MHz. ICC3(max),
tSE(typ) and tBE(typ) values improved. Change of naming for VDFPN8
package
Devices with process technology code X added (Read identification
(RDID) and Table 17: AC characteristics (50 MHz operation)) added.
TSSOP8 package added.
Notes 1 and 2 removed from Table 22: Ordering information scheme and
Note 1 added.
13-Jan-2005
01-Apr-2005
3
4
Note 1 to Table 9: Absolute maximum ratings changed, note 2 and TLEAD
values removed.
Small text changes.
Frequency test condition modified for ICC3 in Table 13: DC characteristics.
Read identification (RDID), Deep power-down (DP) and Release from
deep power-down and read electronic signature (RES) instructions and
Active power, standby power and deep power-down modes paragraph
clarified.
SO8 package specifications updated (see Figure 26. and Table 18).
Updated Page Program (PP) instructions in Page programming, Page
program (PP) and Instruction times.
01-Aug-2005
06-Jul-2006
5
6
Packages are fully ECOPACK® compliant. SO8N and VFQFPN8 package
specifications updated (see Section 11: Package mechanical).
Figure 3: Bus master and memory devices on the SPI bus updated and
Note 2 added. TLEAD removed from Section Table 9.: Absolute maximum
ratings. Small text changes.
VCC supply voltage and VSS ground descriptions added. Figure 3: Bus
master and memory devices on the SPI bus updated, note 2 removed
replaced by explanatory paragraph.
19-Dec-2006
7
WIP bit behavior at power-up specified in Section 7: Power-up and power-
down. TLEAD added and VIO max modified in Table 9: Absolute maximum
ratings. VFQFPN8 and SO8N packages updated (see Section 11:
Package mechanical).
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NUMONYX [ NUMONYX B.V ]
