Numonyx™ Wireless Flash Memory (W18)
4.0
Ballout and Signal Descriptions
4.1
Signal Ballout
The W18 device is available in a 56-ball VF BGA and µBGA Chip Scale Package with
0.75 mm ball pitch, or the 88-ball (80 active balls) QUAD+ SCSP package. Figure 4
shows the device ballout for the VF BGA package. Figure 5 shows the device ballout for
the QUAD+ package.
Figure 4: 56-Ball VF BGA Ballout
1
2
3
4
5
6
7
8
8
7
6
5
4
3
2
1
A
B
C
D
E
F
A
B
C
D
E
F
VCC
CLK
A18
A17
A19
A6
A5
A7
A6
A18
A17
A19
VCC
CLK
A11
A8
A9
VSS
A20
A21
VPP
A4
A3
A2
A4
VPP
VSS
A20
A21
A8
A9
A11
A12
A13
A12
A13
A3
A2
A5
A7
RST#
WE#
RST#
WE#
A10
A10
ADV#
ADV#
A15
A14 WAIT
DQ15 DQ6
A16
DQ12
DQ2
WP#
DQ1
A22
CE#
A1
A0
A1
A0
A22
WP#
DQ1
DQ12
DQ2
A16
WAIT A14
DQ6 DQ15
A15
VCCQ
DQ4
CE#
DQ4
VCCQ
VSS
DQ7
DQ14 DQ13
VSSQ DQ5
DQ11 DQ10
DQ9
DQ0
OE#
OE#
DQ0
DQ9
DQ10 DQ11
DQ13 DQ14
DQ5 VSSQ
VSS
DQ7
G
G
VCC
DQ3
VCCQ DQ8
VSSQ
VSSQ
DQ8 VCCQ
DQ3
VCC
Top View - Ball Side Down
Complete Ink Mark Not Shown
Bottom View - Ball Side Up
Notes:
1.
2.
On lower density devices, upper address balls can be treated as NC.; for example, 32-Mbit density, A21 and A22 are NC).
See Section 3.0, “Package Information” on page 13 for mechanical specifications for the package.
Datasheet
16
November 2007
Order Number: 290701-18