Numonyx™ StrataFlash® Embedded Memory (P33)
Table 3:
TSOP Package Dimensions (Sheet 2 of 2)
Millimeters
Nom
Inches
Nom
Product Information
Symbol
Notes
Min
Max
Min
Max
Lead Count
N
ý
-
0°
56
3°
-
-
0°
56
3°
-
Lead Tip Angle
5°
5°
Seating Plane Coplanarity
Lead to Package Offset
Notes:
Y
Z
-
-
0.100
0.350
-
-
0.004
0.014
0.150
0.250
0.006
0.010
1.
2.
3.
One dimple on package denotes Pin 1.
If two dimples, then the larger dimple denotes Pin 1.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
3.2
64-Ball Easy BGA Package
Figure 2: 64-Mbit and 128-Mbit Easy BGA Mechanical Specifications
S1
Ball A1
Corner
Ball A1
Corner
D
8
7
5
4
3
2
1
1
2
3
4
5
6
7
8
6
S2
A
B
C
D
E
A
B
C
D
b
e
E
E
F
F
G
G
H
H
Top View - Ball side down
Bottom View - Ball Side Up
A1
A2
A
Seating
Plane
Y
Note: Drawing not to scale
Table 4:
64-Mbit and 128-Mbit Easy BGA Package Dimensions (Sheet 1 of 2)
Millimeters
Nom
Inches
Nom
Product Information
Symbol
Notes
Min
Max
Min
Max
Package Height
Ball Height
A
-
0.250
-
-
-
1.200
-
0.0098
-
-
-
0.0472
A1
A2
-
-
-
-
Package Body Thickness
0.780
0.0307
November 2007
Order Number: 314749-05
Datasheet
11
NUMONYX [ NUMONYX B.V ]
