欢迎访问ic37.com |
会员登录 免费注册
发布采购

JS28F256P30TF 参数 Datasheet PDF下载

JS28F256P30TF图片预览
型号: JS28F256P30TF
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash, 16MX16, 110ns, PDSO56, LEAD FREE, TSOP-56]
分类和应用: 时钟光电二极管内存集成电路闪存
文件页数/大小: 91 页 / 983 K
品牌: NUMONYX [ NUMONYX B.V ]
 浏览型号JS28F256P30TF的Datasheet PDF文件第2页浏览型号JS28F256P30TF的Datasheet PDF文件第3页浏览型号JS28F256P30TF的Datasheet PDF文件第4页浏览型号JS28F256P30TF的Datasheet PDF文件第5页浏览型号JS28F256P30TF的Datasheet PDF文件第7页浏览型号JS28F256P30TF的Datasheet PDF文件第8页浏览型号JS28F256P30TF的Datasheet PDF文件第9页浏览型号JS28F256P30TF的Datasheet PDF文件第10页  
P30-65nm  
1.3  
Virtual Chip Enable Description  
The P30-65nm 512Mbit devices employ a Virtual Chip Enable which combines two 256-  
Mbit die with a common chip enable, F1-CE# for QUAD+ packages or CE# for Easy BGA  
packages. (Refer to Figure 9 on page 18 and Figure 10 on page 18). The maximum  
address bit is then used to select between the die pair with F1-CE# / CE# asserted  
depending upon the package option used. When chip enable is asserted and The  
maximum address bit is low (VIL), The lower parameter die is selected; when chip  
enable is asserted and the maximum address bit is high (VIH), the upper parameter die  
is selected. Refer to Table 1 and Table 2 for additional details.  
Table 1:  
Virtual Chip Enable Truth Table for 512 Mb (QUAD+ Package)  
Die Selected  
F1-CE#  
A24  
Lower Param Die  
Upper Param Die  
L
L
L
H
Table 2:  
Virtual Chip Enable Truth Table for 512 Mb (Easy BGA Packages)  
Die Selected  
CE#  
A25  
Lower Param Die  
Upper Param Die  
L
L
L
H
Datasheet  
6
Apr 2009  
Order Number: 320002-08