P33-65nm
Table 1:
TSOP Package Dimensions (Sheet 2 of 2)
Millimeters
Inches
Max
-
5°
0.100
0.350
Min
-
0°
-
0.006
Nom
56
3°
-
0.010
Max
-
5°
0.004
0.014
Symbol
Min
Nom
56
3°
-
0.250
N
θ
Y
Z
-
0°
-
0.150
Product Information
Lead Count
Lead Tip Angle
Seating Plane Coplanarity
Lead to Package Offset
Notes:
1.
2.
3.
4.
One dimple on package denotes Pin 1.
If two dimples, then the larger dimple denotes Pin 1.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
For legacy lead width, 0.10mm(Min), 0.15mm(Typ) and 0.20mm(Max).
2.2
Figure 3:
64-Ball Easy BGA Package
Easy BGA Mechanical Specifications (8x10x1.2 mm)
S1
Ball A1
Corner
1
A
B
C
D
E
E
F
G
H
2
3
4
D
5
6
7
8
A
B
C
D
E
F
G
H
e
b
8
7
6
5
4
3
2
1
Ball A1
Corner
S2
Top View - Ball side down
Bottom View - Ball Side Up
A1
A2
A
Seating
Plane
Y
Note: Drawing not to scale
Datasheet
8
Jul 2011
Order Number: 208034-04
NUMONYX [ NUMONYX B.V ]
