P30
Table 6:
QUAD+ SCSP Signal Descriptions (Sheet 2 of 2)
Symbol
Type
Name and Function
Device Core Power Supply: Core (logic) source voltage. Writes to the flash array are inhibited
when VCC ≤ VLKO. Operations at invalid VCC voltages should not be attempted.
VCC
Power
VCCQ
VSS
Power
Power
Output Power Supply: Output-driver source voltage.
Ground: Connect to system ground. Do not float any VSS connection.
Reserved for Future Use: Reserved by Numonyx for future device functionality and enhancement.
These should be treated in the same way as a Do Not Use (DU) signal.
RFU
—
DU
NC
—
—
Do Not Use: Do not connect to any other signal, or power supply; must be left floating.
No Connect: No internal connection; can be driven or floated.
4.3
Dual-Die Configurations
Figure 9: 512-Mbit Easy BGA and TSOP Top or Bottom Parameter Block Diagram
Easy BGA & TSOP 512-Mbit (Dual-Die) Top or Bottom Parameter
Configuration
CE#
Top Param Die
RST#
WP#
OE#
WE#
(256-Mbit)
VCC
VPP
VCCQ
VSS
CLK
ADV#
Bottom Param Die
(256-Mbit)
DQ[15:0]
WAIT
A[MAX:1]
Figure 10: 512-Mbit QUAD+ SCSP Top or Bottom Parameter Block Diagram
QUAD+ 512-Mbit (Dual-Die) Top or Bottom Parameter
Configuration
F1-CE#
Top Param Die
RST#
WP#
OE#
WE#
(256-Mbit)
VCC
VPP
VCCQ
VSS
CLK
ADV#
Bottom Param Die
(256-Mbit)
DQ[15:0]
WAIT
A[MAX:0]
Note: Amax = Vih selects the Top parameter Die; Amax = Vil selects the Bottom Parameter Die.
November 2007
Order Number: 306666-11
Datasheet
21
NUMONYX [ NUMONYX B.V ]
