32WQ and 64WQ Family with Asynchronous RAM
Figure 3: Mechanical Specifications for Triple-Die SCSP Device (8x10x1.4 mm)
A1
S1
Index
Mark
1
2
3
4
5
6
7
8
8
7
6
5
4
3
2
1
S2
A
A
B
C
D
B
C
D
E
F
E
F
D
e
G
H
G
H
J
J
K
K
L
L
M
M
b
E
Top View - Ball Down
Bottom View - Ball Up
A
A2
A1
Y
Drawing not to scale.
Millimeters
Nom
Inches
Nom
Dimensions
Symbol
Min
Max Notes
Min
Max
Package Height
Ball Height
Package Body Thickness
Ball (Lead) Width
Package Body Length
Package Body Width
Pitch
A
A1
A2
b
D
E
1.400
0.0551
0.200
0.0079
1.070
0.375
10.000
8.000
0.800
88
0.0421
0.0148
0.3937
0.3150
0.0315
88
0.325
9.900
7.900
0.425
10.100
8.100
0.0128
0.3898
0.3110
0.0167
0.3976
0.3189
e
N
Ball (Lead) Count
Seating Plane Coplanarity
Corner to Ball A1 Distance Along E
Corner to Ball A1 Distance Along D
Y
S1
S2
0.100
1.300
0.700
0.0039
0.0512
0.0276
1.100
0.500
1.200
0.600
0.0433
0.0197
0.0472
0.0236
November 2007
Order Number: 251407-13
Datasheet
11