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LP2951ACM-3.3 参数 Datasheet PDF下载

LP2951ACM-3.3图片预览
型号: LP2951ACM-3.3
PDF下载: 下载PDF文件 查看货源
内容描述: 系列微功率可调稳压器 [Series of Adjustable Micropower Voltage Regulators]
分类和应用: 稳压器调节器光电二极管输出元件
文件页数/大小: 26 页 / 1200 K
品牌: NSC [ National Semiconductor ]
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Electrical Characteristics (Note 2) (Continued)  
LP2951  
LP2950AC-XX  
LP2951AC-XX  
Tested Design  
LP2950C-XX  
LP2951C-XX  
Conditions  
(Note 2)  
Parameter  
Tested  
Limit  
Tested Design  
Units  
Typ  
Typ  
Limit  
Limit  
Typ  
Limit  
Limit  
(Notes 3, 16)  
(Note 3) (Note 4)  
(Note 3) (Note 4)  
All Voltage Options  
Temperature  
Coefficient  
Feedback Pin Bias  
Current Temperature  
Coefficient  
0.1  
0.1  
0.1  
nA/˚C  
Error Comparator  
Output Leakage  
Current  
VOH = 30V  
0.01  
150  
1
2
0.01  
150  
1
0.01  
150  
1
µA max  
µA max  
mV max  
2
2
Output Low  
Vin = (VONOM −  
0.5)V  
250  
250  
250  
Voltage  
IOL = 400µA  
(Note 6)  
400  
40  
400  
400  
mV max  
mV min  
mV min  
mV max  
mV max  
mV  
Upper Threshold  
Voltage  
60  
75  
15  
1.3  
60  
75  
15  
1.3  
40  
60  
75  
15  
1.3  
40  
25  
25  
25  
Lower Threshold  
Voltage  
(Note 6)  
(Note 6)  
95  
95  
95  
140  
140  
140  
Hysteresis  
Shutdown Input  
Input  
V
Logic  
Low (Regulator  
ON)  
0.6  
2.0  
0.7  
2.0  
0.7  
2.0  
V max  
Voltage  
High (Regulator  
OFF)  
V min  
Shutdown Pin Input  
Current  
Vshutdown = 2.4V  
30  
450  
3
50  
100  
600  
750  
10  
30  
450  
3
50  
100  
600  
750  
10  
30  
450  
3
50  
100  
600  
750  
10  
µA max  
µA max  
µA max  
µA max  
µA max  
µA max  
Vshutdown = 30V  
(Note 11)  
Regulator Output  
Current in Shutdown  
20  
20  
20  
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device  
is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical  
Characteristics tables.  
Note 2: Unless otherwise specified all limits guaranteed for V = (V  
+ 1)V, I = 100µA and C = 1µF for 5V versions and 2.2µF for 3V and 3.3V versions. Limits  
L L  
IN  
ONOM  
appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for T = T = 25˚C. Additional  
A
J
conditions for the 8-pin versions are FEEDBACK tied to V  
, OUTPUT tied to SENSE, and V  
0.8V.  
TAP  
SHUTDOWN  
Note 3: Guaranteed and 100% production tested.  
Note 4: Guaranteed but not 100% production tested. These limits are not used to calculate outgoing AQL levels.  
Note 5: Dropout Voltage is defined as the input to output differential at which the output voltage drops 100 mV below its nominal value measured at 1V differential.  
At very low values of programmed output voltage, the minimum input supply voltage of 2V (2.3V over temperature) must be taken into account.  
Note 6: Comparator thresholds are expressed in terms of a voltage differential at the Feedback terminal below the nominal reference voltage measured at V  
=
in  
(V NOM + 1)V. To express these thresholds in terms of output voltage change, multiply by the error amplifier gain = V /V = (R1 + R2)/R2.For example, at a  
O
out ref  
programmed output voltage of 5V, the Error output is guaranteed to go low when the output drops by 95mV x 5V/1.235V = 384 mV. Thresholds remain constant as  
a percent of V as V is varied, with the dropout warning occurring at typically 5% below nominal, 7.5% guaranteed.  
out  
out  
Note 7: V V (V − 1V), 2.3V V 30V, 100µA I 100mA, T T .  
JMAX  
ref  
out  
in  
in  
L
J
Note 8: The junction-to-ambient thermal resistances are as follows: 180˚C/W and 160˚C/W for the TO-92 package with 0.40 inch and 0.25 inch leads to the printed  
circuit board (PCB) respectively, 105˚C/W for the molded plastic DIP (N), 130˚C/W for the ceramic DIP (J), 160˚C/W for the molded plastic SOP (M), 200˚C/W for  
the molded plastic MSOP (MM), and 160˚C/W for the metal can package (H). The above thermal resistances for the N, J, M, and MM packages apply when the  
package is soldered directly to the PCB. Junction-to-case thermal resistance for the H package is 20˚C/W. Junction-to-case thermal resistance for the TO-252  
package is 5.4˚C/W. The value of θ for the LLP package is typically 51˚C/W but is dependent on the PCB trace area, trace material, and the number of layers and  
JA  
thermal vias. For details of thermal resistance and power dissipation for the LLP package, refer to Application Note AN-1187.  
Note 9: May exceed input supply voltage.  
7
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