Typical Applications (Continued)
LM833 MDC MWC
DUAL AUDIO OPERATIONAL AMPLIFIER
00521854
Die Layout (A - Step)
DIE/WAFER CHARACTERISTICS
Fabrication Attributes
General Die Information
Physical Die Identification
Die Step
LM833A
Bond Pad Opening Size (min)
Bond Pad Metalization
Passivation
110µm x 110µm
ALUMINUM
VOM NITRIDE
BARE BACK
Floating
A
Physical Attributes
Wafer Diameter
150mm
Back Side Metal
Dise Size (Drawn)
1219µm x 1270µm Back Side Connection
48mils x 50mils
Thickness
Min Pitch
406µm Nominal
288µm Nominal
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
Die Bond Pad Coordinate Locations (A - Step)
(Referenced to die center, coordinates in µm) NC = No Connection
X/Y COORDINATES
PAD SIZE
SIGNAL NAME
PAD# NUMBER
X
Y
X
Y
OUTPUT A
INPUT A-
INPUT A+
VEE-
1
2
3
4
5
6
7
8
-476
-476
-476
-0
500
-212
-500
-500
-500
-212
500
500
110
110
110
110
110
110
110
110
x
x
x
x
x
x
x
x
110
110
110
110
110
110
110
110
INPUT B+
INPUT B-
OUTPUT B
VCC+
476
476
476
0
15
www.national.com
NSC [ National Semiconductor ]
