LM78LXX Series
Physical Dimensions
inches (millimeters) unless otherwise noted
NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. 63Sn/37Pb EUTECTIC BUMP
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN 1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE
NUMBERED COUNTERCLOCKWISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X
1
IS PACKAGE WIDTH, X
2
IS PACK-
AGE LENGTH AND X
3
IS PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
8-Bump micro SMD
Order Number LM78L05IBP or LM78L05IBPX
NS Package Number BPA08AAA
X
1
= 1.285 X
2
= 1.285 X
3
= 0.7
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