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LM4872ITPX/NOPB 参数 Datasheet PDF下载

LM4872ITPX/NOPB图片预览
型号: LM4872ITPX/NOPB
PDF下载: 下载PDF文件 查看货源
内容描述: [IC,AUDIO AMPLIFIER,SINGLE,BGA,8PIN,PLASTIC]
分类和应用: 放大器功率放大器
文件页数/大小: 14 页 / 428 K
品牌: NSC [ National Semiconductor ]
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Application Information (Continued)  
REFERENCE DESIGN BOARD and PCB LAYOUT  
GUIDELINES  
DS101230-25  
Figure 4  
PCB Layout Guidelines  
Single-Point Power / Ground Connections  
This section provides practical guidelines for mixed signal  
PCB layout that involves various digital/analog power and  
ground traces. Designers should note that these are only  
rule-of-thumbrecommendations and the actual results will  
depend heavily on the final layout.  
The analog power traces should be connected to the digital  
traces through a single point (link). A Pi-filtercan be helpful  
in minimizing High Frequency noise coupling between the  
analog and digital sections. It is further recommended to put  
digital and analog power traces over the corresponding digi-  
tal and analog ground traces to minimize noise coupling.  
General Mixed Signal Layout Recommendation  
Placement of Digital and Analog Components  
Power and Ground Circuits  
All digital components and high-speed digital signals traces  
should be located as far away as possible from analog com-  
ponents and circuit traces.  
For 2 layer mixed signal design, it is important to isolate the  
digital power and ground trace paths from the analog power  
and ground trace paths. Star trace routing techniques (bring-  
ing individual traces back to a central point rather than daisy  
chaining traces together in a serial manner) can have a ma-  
jor impact on low level signal performance. Star trace routing  
refers to using individual traces to feed power and ground to  
each circuit or even device. This technique will take require  
a greater amount of design time but will not increase the final  
price of the board. The only extra parts required will be some  
jumpers.  
Avoiding Typical Design / Layout Problems  
Avoid ground loops or running digital and analog traces par-  
allel to each other (side-by-side) on the same PCB layer.  
When traces must cross over each other do it at 90 degrees.  
Running digital and analog traces at 90 degrees to each  
other from the top to the bottom side as much as possible will  
minimize capacitive noise coupling and cross talk.  
13  
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