LM4871 MDA MWA 3W Audio Power Amplifier With Shutdown Mode
10000840
Die Layout (C - Step)
Die/Wafer Characteristics
Fabrication Attributes
General Die Information
Bond Pad Opening Size (min) 102µm x 102µm
Physical Die Identification
LM4871C
C
Die Step
Bond Pad Metalization
0.5%
COPPER_BAL.
ALUMINUM
NITRIDE
Physical Attributes
Passivation
Wafer Diameter
150mm
Back Side Metal
BARE BACK
GND
Dise Size (Drawn)
1372µm x 1758µm Back Side Connection
54mils x 69mils
Thickness
Min Pitch
406µm Nominal
164µm Nominal
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
Die Bond Pad Coordinate Locations (C - Step)
(Referenced to die center, coordinates in µm) NC = No Connection
X/Y COORDINATES PAD SIZE
SIGNAL NAME PAD# NUMBER
X
Y
X
Y
SHUTDOWN
BYPASS
NC
1
2
-559
-559
-559
-559
-559
-476
-135
554
541
376
-45
102
102
102
102
102
102
102
102
102
102
102
102
x
x
x
x
x
x
x
x
x
x
x
x
102
102
210
102
102
102
210
102
210
102
210
102
3
INPUT +
INPUT -
GND
4
-248
-486
-725
-598
-686
-4
5
6
VOUT 1
GND
7
8
VDD
9
554
GND
10
11
12
554
568
598
752
VOUT 2
GND
-135
-473
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