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LM4863MTE 参数 Datasheet PDF下载

LM4863MTE图片预览
型号: LM4863MTE
PDF下载: 下载PDF文件 查看货源
内容描述: 双2.2W音频放大器加上立体声耳机功能 [Dual 2.2W Audio Amplifier Plus Stereo Headphone Function]
分类和应用: 音频放大器
文件页数/大小: 16 页 / 515 K
品牌: NSC [ NATIONAL SEMICONDUCTOR ]
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LM4863
External Components Description
(Figure
1
)
Components
1.
2.
R
i
C
i
Functional Description
Inverting input resistance which sets the closed-loop gain in conjunction with R
f
. This resistor also forms a
high pass filter with C
i
at f
c
= 1/(2πR
i
C
i
).
Input coupling capacitor which blocks the DC voltage at the amplifier’s input terminals. Also creates a
highpass filter with R
i
at f
c
= 1/(2πR
i
C
i
). Refer to the section,
Proper Selection of External Components,
for an explanation of how to determine the value of C
i
.
Feedback resistance which sets the closed-loop gain in conjunction with R
i
.
Supply bypass capacitor which provides power supply filtering. Refer to the
Power Supply Bypassing
section for information concerning proper placement and selection of the supply bypass capacitor.
Bypass pin capacitor which provides half-supply filtering. Refer to the section,
Proper Selection of
External Components,
for information concerning proper placement and selection of C
B
.
3.
4.
5.
R
f
C
s
C
B
Typical Performance Characteristics
MTE Specific Characteristics
LM4863MTE
THD+N vs Output Power
LM4863MTE
THD+N vs Frequency
LM4863MTE
THD+N vs Output Power
DS012881-97
DS012881-99
DS012881-96
LM4863MTE
THD+N vs Frequency
LM4863MTE
Power Dissipation vs Power Output
LM4863MTE(Note
16)
Power Derating Curve
DS012881-90
DS012881-98
DS012881-95
Note 16:
These curves show the thermal dissipation ability of the LM4863MTE at different ambient temperatures given these conditions:
500LFPM + JEDEC board:
The part is soldered to a 1S2P 20-lead exposed-DAP TSSOP test board with 500 linear feet per minute of forced-air flow across
it.
Board information
- copper dimensions: 74x74mm, copper coverage: 100% (buried layer) and 12% (top/bottom layers), 16 vias under the exposed-DAP.
500LFPM + 2.5in
2
:
The part is soldered to a 2.5in
2
, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it.
2.5in
2
:
The part is soldered to a 2.5in
2
, 1oz. copper plane.
Not Attached:
The part is not soldered down and is not forced-air cooled.
5
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