Typical Performance Characteristics
MTE Specific Characteristics
LM4835MTE
THD+N vs Output Power
LM4835MTE
THD+N vs Frequency
LM4835MTE
THD+N vs Output Power
DS100139-70
DS100139-71
DS100139-72
LM4835MTE
THD+N vs Frequency
LM4835MTE
Power Dissipation vs Output Power
LM4835MTE(Note
17)
Power Derating Curve
DS100139-73
DS100139-65
DS100139-64
Note 17:
These curves show the thermal dissipation ability of the LM4835MTE at different ambient temperatures given these conditions:
500LFPM + 2in
2
:
The part is soldered to a 2in
2
, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it.
2in
2
on bottom:
The part is soldered to a 2in
2
, 1oz. copper plane that is on the bottom side of the PC board through 21 8 mil vias.
2in
2
:
The part is soldered to a 2in
2
, 1oz. copper plane.
1in
2
:
The part is soldered to a 1in
2
, 1oz. copper plane.
Not Attached:
The part is not soldered down and is not forced-air cooled.
Non-MTE Specific Characteristics
THD+N vs Frequency
THD+N vs Frequency
DS100139-57
DS100139-58
5
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