Typical Performance Characteristics
MTE Specific Characteristics
LM4835MTE
THD+N vs Output Power
LM4835MTE
THD+N vs Frequency
LM4835MTE
THD+N vs Output Power
DS100139-70
DS100139-71
DS100139-72
LM4835MTE
THD+N vs Frequency
LM4835MTE
Power Dissipation vs Output Power
LM4835MTE(Note 17)
Power Derating Curve
DS100139-73
DS100139-65
DS100139-64
Note 17: These curves show the thermal dissipation ability of the LM4835MTE at different ambient temperatures given these conditions:
2
2
500LFPM + 2in : The part is soldered to a 2in , 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it.
2
2
2in on bottom: The part is soldered to a 2in , 1oz. copper plane that is on the bottom side of the PC board through 21 8 mil vias.
2
2
2in : The part is soldered to a 2in , 1oz. copper plane.
2
2
1in : The part is soldered to a 1in , 1oz. copper plane.
Not Attached: The part is not soldered down and is not forced-air cooled.
Non-MTE Specific Characteristics
THD+N vs Frequency
THD+N vs Frequency
DS100139-58
DS100139-57
5
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