LM386
Absolute Maximum Ratings
(Note 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage
(LM386N-1, -3, LM386M-1)
Supply Voltage (LM386N-4)
Package Dissipation (Note 3)
(LM386N)
(LM386M)
(LM386MM-1)
Input Voltage
Storage Temperature
Operating Temperature
Junction Temperature
Soldering Information
15V
22V
1.25W
0.73W
0.595W
±
0.4V
−65˚C to +150˚C
0˚C to +70˚C
+150˚C
Dual-In-Line Package
Soldering (10 sec)
+260˚C
Small Outline Package
(SOIC and MSOP)
Vapor Phase (60 sec)
+215˚C
Infrared (15 sec)
+220˚C
See AN-450 “Surface Mounting Methods and Their Effect
on Product Reliability” for other methods of soldering
surface mount devices.
Thermal Resistance
37˚C/W
θ
JC
(DIP)
107˚C/W
θ
JA
(DIP)
35˚C/W
θ
JC
(SO Package)
172˚C/W
θ
JA
(SO Package)
210˚C/W
θ
JA
(MSOP)
56˚C/W
θ
JC
(MSOP)
Electrical Characteristics
(Notes 1, 2)
T
A
= 25˚C
Parameter
Operating Supply Voltage (V
S
)
LM386N-1, -3, LM386M-1, LM386MM-1
LM386N-4
Quiescent Current (I
Q
)
Output Power (P
OUT
)
LM386N-1, LM386M-1, LM386MM-1
LM386N-3
LM386N-4
Voltage Gain (A
V
)
Bandwidth (BW)
Total Harmonic Distortion (THD)
Power Supply Rejection Ratio (PSRR)
Input Resistance (R
IN
)
Input Bias Current (I
BIAS
)
V
S
= 6V, Pins 2 and 3 Open
Note 1:
All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 2:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func-
tional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guar-
antee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is
given, however, the typical value is a good indication of device performance.
Note 3:
For operation in ambient temperatures above 25˚C, the device must be derated based on a 150˚C maximum junction temperature and 1) a thermal resis-
tance of 107˚C/W junction to ambient for the dual-in-line package and 2) a thermal resistance of 170˚C/W for the small outline package.
Conditions
Min
4
5
Typ
Max
12
18
Units
V
V
mA
mW
mW
mW
dB
dB
kHz
%
dB
kΩ
nA
V
S
= 6V, V
IN
= 0
V
S
= 6V, R
L
= 8Ω, THD = 10%
V
S
= 9V, R
L
= 8Ω, THD = 10%
V
S
= 16V, R
L
= 32Ω, THD = 10%
V
S
= 6V, f = 1 kHz
10 µF from Pin 1 to 8
V
S
= 6V, Pins 1 and 8 Open
V
S
= 6V, R
L
= 8Ω, P
OUT
= 125 mW
f = 1 kHz, Pins 1 and 8 Open
V
S
= 6V, f = 1 kHz, C
BYPASS
= 10 µF
Pins 1 and 8 Open, Referred to Output
250
500
700
4
325
700
1000
26
46
300
0.2
50
50
250
8
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