Absolute Maximum Ratings
(Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage
Peak Current
Package Dissipation 14-Pin DIP (Note 7)
Package Dissipation 8-Pin DIP (Note 7)
Input Voltage
Storage Temperature
22V
1.3A
8.3W
1.67W
±
0.5V
−65˚C to +150˚C
Operating Temperature
Junction Temperature
Lead Temperature (Soldering, 10 sec.)
ESD rating to be determined
Thermal Resistance
θ
JC
(14-Pin DIP)
θ
JC
(8-Pin DIP)
θ
JA
(14-Pin DIP)
θ
JA
(8-Pin DIP)
0˚C to +70˚C
+150˚C
+260˚C
30˚C/W
37˚C/W
79˚C/W
107˚C/W
Electrical Characteristics
(Note 2)
Symbol
P
OUT(RMS)
A
V
V
OUT
Z
IN
THD
PSRR
V
S
BW
I
Q
V
OUTQ
I
BIAS
I
SC
Gain
Output Voltage Swing
Input Resistance
Total Harmonic Distortion
Power Supply Rejection Ratio
Supply Voltage
Bandwidth
Quiescent Supply Current
Quiescent Output Voltage
Bias Current
Short Circuit Current
Inputs Floating
8
P
OUT
= 2W, R
L
= 8Ω
(Notes 5, 6)
(Note 3)
10
100k
7
9.0
100
1.3
25
10
R
L
= 8Ω
Parameter
Output Power
Conditions
R
L
= 8Ω, THD = 3% (Notes 4, 5)
Min
2.5
40
50
14
150k
0.2
38
22
60
Typ
Max
Units
W
V/V
V
p-p
Ω
%
dB
V
Hz
mA
V
nA
A
Note 1:
“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits.
Note 2:
V
S
= 18V and T
A
= 25˚C unless otherwise specified.
Note 3:
Rejection ratio referred to the output with C
BYPASS
= 5 µF.
Note 4:
With device Pins 3, 4, 5, 10, 11, 12 soldered into a 1/16" epoxy glass board with 2 ounce copper foil with a minimum surface of 6 square inches.
Note 5:
C
BYPASS
= 0.47 µfd on Pin 1.
Note 6:
The maximum junction temperature of the LM380 is 150˚C.
Note 7:
The package is to be derated at 15˚C/W junction to heat sink pins for 14-pin pkg; 75˚C/W for 8-pin.
3
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