LM117/LM317A/LM317
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Power Dissipation
Input-Output Voltage Differential
Storage Temperature
Lead Temperature
Metal Package (Soldering, 10 seconds)
Plastic Package (Soldering, 4 seconds)
300˚C
260˚C
Internally Limited
+40V, −0.3V
−65˚C to +150˚C
ESD Tolerance (Note 5)
3 kV
Operating Temperature Range
LM117
LM317A
LM317
Preconditioning
Thermal Limit Burn-In
All Devices 100%
−55˚C
≤
T
J
≤
+150˚C
−40˚C
≤
T
J
≤
+125˚C
0˚C
≤
T
J
≤
+125˚C
Electrical Characteristics
Specifications with standard type face are for T
J
= 25˚C, and those with
boldface type
apply over
full Operating Tempera-
ture Range.
Unless otherwise specified, V
IN
− V
OUT
= 5V, and I
OUT
= 10 mA.
Parameter
Reference Voltage
3V
≤
(V
IN
− V
OUT
)
≤
40V,
10 mA
≤
I
OUT
≤
I
MAX
, P
≤
P
MAX
Line Regulation
Load Regulation
Thermal Regulation
Adjustment Pin Current
Adjustment Pin Current Change
Temperature Stability
Minimum Load Current
Current Limit
10 mA
≤
I
OUT
≤
I
MAX
3V
≤
(V
IN
− V
OUT
)
≤
40V
T
MIN
≤
T
J
≤
T
MAX
(V
IN
− V
OUT
) = 40V
(V
IN
− V
OUT
)
≤
15V
K Package
H Package
(V
IN
− V
OUT
) = 40V
K Package
H Package
RMS Output Noise, % of V
OUT
Ripple Rejection Ratio
10 Hz
≤
f
≤
10 kHz
V
OUT
= 10V, f = 120 Hz,
C
ADJ
= 0 µF
V
OUT
= 10V, f = 120 Hz,
C
ADJ
= 10 µF
Long-Term Stability
Thermal Resistance,
Junction-to-Case
Thermal Resistance, Junction-
to-Ambient (No Heat Sink)
T
J
= 125˚C, 1000 hrs
K Package
H Package
E Package
K Package
H Package
E Package
35
140
0.3
2.3
12
1
3
15
%
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
66
80
dB
0.3
0.15
0.4
0.2
0.003
65
A
A
%
dB
1.5
0.5
2.2
0.8
3.4
1.8
A
A
1
3.5
5
%
mA
3V
≤
(V
IN
− V
OUT
)
≤
40V (Note 4)
10 mA
≤
I
OUT
≤
I
MAX
20 ms Pulse
0.01
0.02
0.1
0.3
0.03
50
0.2
0.02
0.05
0.3
1
0.07
100
5
%/V
%/V
%
%
%/W
µA
µA
1.20
1.25
1.30
Conditions
Min
LM117
Typ
Max
V
V
Units
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