LM117/LM317A/LM317
LM317A and LM317 Electrical Characteristics
(Note 3)
Specifications with standard type face are for T
J
= 25°C, and those with
boldface type
apply over
full Operating Temperature
Range.
Unless otherwise specified, V
IN
− V
OUT
= 5V, and I
OUT
= 10 mA.
Parameter
Conditions
LM317A
Min
1.238
Reference Voltage
3V
≤
(V
IN
− V
OUT
)
≤
40V,
10 mA
≤
I
OUT
≤
I
MAX
Line Regulation
Load Regulation
Thermal Regulation
Adjustment Pin Current
Adjustment Pin Current Change
Temperature Stability
Minimum Load Current
10 mA
≤
I
OUT
≤
I
MAX
T
MIN
≤
T
J
≤
T
MAX
(V
IN
− V
OUT
) = 40V
(V
IN
− V
OUT
)
≤
15V
K, T, S Packages
EMP Package
H, MDT Packages
(V
IN
− V
OUT
) = 40V
K, T, S Packages
EMP Package
H, MDT Packages
RMS Output Noise, % of V
OUT
Ripple Rejection Ratio
Long-Term Stability
10 Hz
≤
f
≤
10 kHz
V
OUT
= 10V, f = 120 Hz, C
ADJ
= 0 μF
V
OUT
= 10V, f = 120 Hz, C
ADJ
= 10 μF
T
J
= 125°C, 1000 hrs
K (TO-3) Package
T (TO-220) Package
S (TO-263) Package
EMP (SOT-223) Package
H (TO-39) Package
MDT (TO-252) Package
K (TO-3) Package
T (TO-220) Package
S (TO-263) Package (Note 6)
EMP (SOT-223) Package (Note 6)
H (TO-39) Package
MDT (TO-252) Package (Note 6)
66
-
0.112
0.075
-
0.30
0.20
0.003
65
80
0.3
-
-
-
23.5
21
12
-
-
-
140
186
103
1
66
0.15
0.112
0.075
0.40
0.30
0.20
0.003
65
80
0.3
2
4
4
23.5
21
12
39
50
50
140
186
103
1
A
%
dB
dB
%
-
1.5
0.5
-
2.2
0.8
-
3.4
1.8
1.5
1.5
0.5
2.2
2.2
0.8
3.4
3.4
1.8
A
3V
≤
(V
IN
− V
OUT
)
≤
40V
3V
≤
(V
IN
− V
OUT
)
≤
40V (Note 4)
10 mA
≤
I
OUT
≤
I
MAX
(Note 4)
20 ms Pulse
1.225
Typ
1.250
1.250
0.005
0.01
0.1
0.3
0.04
50
0.2
1
3.5
10
Max
1.262
1.270
0.01
0.02
0.5
1
0.07
100
5
Min
-
1.20
LM317
Typ
1.25
1.25
0.01
0.02
0.1
0.3
0.04
50
0.2
1
3.5
10
Max
-
1.30
0.04
0.07
0.5
1.5
0.07
100
5
Units
V
V
%/V
%
%/W
μA
μA
%
mA
Current Limit
Thermal Resistance,
θ
JC
Junction-to-Case
°C/W
Thermal Resistance,
θ
JA
Junction-to-Ambient
(No Heat Sink)
°C/W
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics.
The guaranteed specifications apply only for the test conditions listed.
Note 2:
Refer to RETS117H drawing for the LM117H, or the RETS117K for the LM117K military specifications.
Note 3:
I
MAX
= 1.5A for the K (TO-3), T (TO-220), and S (TO-263) packages. I
MAX
= 1.0A for the EMP (SOT-223) package. I
MAX
= 0.5A for the H (TO-39), MDT
(TO-252), and E (LCC) packages. Device power dissipation (P
D
) is limited by ambient temperature (T
A
), device maximum junction temperature (T
J
), and package
thermal resistance (θ
JA
). The maximum allowable power dissipation at any temperature is : P
D(MAX)
= ((T
J(MAX)
- T
A
)/θ
JA
). All Min. and Max. limits are guaranteed
to National's Average Outgoing Quality Level (AOQL).
Note 4:
Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects
are covered under the specifications for thermal regulation.
Note 5:
Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Note 6:
When surface mount packages are used (TO-263, SOT-223, TO-252), the junction to ambient thermal resistance can be reduced by increasing the PC
board copper area that is thermally connected to the package. See the Applications Hints section for heatsink techniques.
5
www.national.com
NSC [ NATIONAL SEMICONDUCTOR ]
