Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
NOTE: UNLESS OTHERWISE SPECIFIED.
1. EPOXY COATING
2. 63Sn/37Pb EUTECTIC BUMP.
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN 1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION PINS ARE NUMBERED
COUNTERCLOCKWISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACK-
AGE LENGTH AND X3 IS PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
6-Bump micro SMD
NS Package Number BPA06HPA
X1 = 0.955 X2 = 1.615 X3 =0.700
www.national.com
16
NSC [ National Semiconductor ]
