Electrical Characteristics for Fixed 5V Version (Continued)
VIN = 14V, IO = 10mA, TJ = 25˚C, C2 = 100 µF (unless otherwise specified) (Note 2)
Parameter
Conditions
LM2931A-5.0
LM2931-5.0
Units
Limit
(Note 3)
Limit
(Note 3)
Typ
Typ
Quiescent Current
IO ≤ 10mA, 6V ≤ VIN ≤ 26V
−40˚C ≤ TJ ≤ 125˚C
0.4
1.0
0.4
1.0
mAMAX
IO = 100mA, VIN = 14V, TJ = 25˚C
15
30
5
15
mAMAX
mAMIN
Output Noise Voltage
Long Term Stability
10Hz -100kHz, COUT = 100µF
500
20
500
20
µVrms
mV/1000
hr
Ripple Rejection
Dropout Voltage
fO = 120 Hz
80
55
80
dBMIN
VMAX
VMIN
IO = 10mA
IO = 100mA
0.05
0.3
0.2
0.6
0.05
0.3
0.2
0.6
Maximum Operational Input
Voltage
33
26
33
26
Maximum Line Transient
RL = 500Ω, VO ≤ 5.5V,
T = 1ms, τ ≤ 100ms
70
60
70
50
VMIN
VMIN
Reverse Polarity Input
Voltage, DC
VO ≥ −0.3V, RL = 500Ω
−30
−15
−30
−15
Reverse Polarity Input
Voltage, Transient
T = 1ms, τ ≤ 100ms, RL = 500Ω
−80
−50
−80
−50
VMIN
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device
beyond its rated operating conditions.
Note 2: See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
Note 3: All limits are guaranteed for T = 25˚C (standard type face) or over the full operating junction temperature range of −40˚C to +125˚C (bold type face).
J
Note 4: The maximum power dissipation is a function of maximum junction temperature T
, total thermal resistance θ , and ambient temperature T . The maxi-
JA A
Jmax
mum allowable power dissipation at any ambient temperature is P = (T
− T )/θ . If this dissipation is exceeded, the die temperature will rise above 150˚C and
A JA
D
Jmax
the LM2931 will go into thermal shutdown. For the LM2931 in the TO-92 package, θ is 195˚C/W; in the SO-8 package, θ is 160˚C/W, and in the TO-220 package,
JA
JA
θ
is 50˚C/W; in the TO-263 package, θ is 73˚C/W; and in the 6-Bump micro SMD package θ is 290˚C/W. If the TO-220 package is used with a heat sink, θ
JA JA JA
JA
is the sum of the package thermal resistance junction-to-case of 3˚C/W and the thermal resistance added by the heat sink and thermal interface.
If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package: Using 0.5 square
inches of copper area, θ is 50˚C/W; with 1 square inch of copper area, θ is 37˚C/W; and with 1.6 or more square inches of copper area, θ is 32˚C/W.
JA
JA
JA
Note 5: Human body model, 100 pF discharged through 1.5 kΩ.
Electrical Characteristics for Adjustable Version
VIN = 14V, VOUT = 3V, IO = 10 mA, TJ = 25˚C, R1 = 27k, C2 = 100 µF (unless otherwise specified) (Note 2)
Parameter
Conditions
Typ
Limit
Units
Limit
VMAX
VMIN
Reference Voltage
1.20
1.26
1.14
1.32
1.08
24
IO ≤ 100 mA, −40˚C ≤ Tj ≤ 125˚C, R1 = 27k
VMAX
VMIN
Measured from VOUT to Adjust Pin
Output Voltage Range
VMAX
VMIN
3
Line Regulation
Load Regulation
Output Impedance
Quiescent Current
VOUT + 0.6V ≤ VIN ≤ 26V
5 mA ≤ IO ≤ 100 mA
100 mADC and 10 mArms, 100 Hz–10 kHz
IO = 10 mA
0.2
0.3
40
1.5
1
mV/VMAX
%
MAX
mΩ/V
mAMAX
mA
0.4
15
1
1
IO = 100 mA
During Shutdown RL = 500Ω
10 Hz–100 kHz
0.8
100
0.4
0.02
mAMAX
µVrms/V
%/1000 hr
%/V
Output Noise Voltage
Long Term Stability
Ripple Rejection
fO = 120 Hz
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