LM2931
Electrical Characteristics for Fixed 5V Version
V
IN
= 14V, I
O
= 10mA, T
J
= 25°C, C2 = 100
μF
(unless otherwise specified) (Note 2)
Parameter
Conditions
LM2931A-5.0
Typ
Output Voltage
5
Limit
(Note 3)
5.19
4.81
5.25
4.75
2
4
14
200
0.4
1.0
10
30
50
2
4
14
200
0.4
1.0
LM2931-5.0
Typ
5
Limit
(Note 3)
5.25
4.75
5.5
4.5
10
30
50
V
MAX
V
MIN
V
MAX
V
MIN
mV
MAX
mV
MAX
mΩ
mA
MAX
Units
6.0V
≤
V
IN
≤
26V, I
O
= 100mA
−40°C
≤
T
J
≤
125°C
Line Regulation
9V
≤
V
IN
≤
16V
6V
≤
V
IN
≤
26V
Load Regulation
Output Impedance
Quiescent Current
5 mA
≤
I
O
≤
100mA
100mA
DC
and 10mA
rms
,
100Hz -10kHz
I
O
≤
10mA, 6V
≤
V
IN
≤
26V
−40°C
≤
T
J
≤
125°C
I
O
= 100mA, V
IN
= 14V, T
J
= 25°C
Output Noise Voltage
Long Term Stability
Ripple Rejection
Dropout Voltage
f
O
= 120 Hz
I
O
= 10mA
I
O
= 100mA
Maximum Operational Input
Voltage
Maximum Line Transient
R
L
= 500Ω,
V
O
≤
5.5V,
T = 1ms,
τ ≤
100ms
Reverse Polarity Input Voltage, V
O
≥
−0.3V, R
L
= 500Ω
DC
Reverse Polarity Input Voltage, T = 1ms,
τ ≤
100ms, R
L
= 500Ω
Transient
10Hz -100kHz, C
OUT
= 100μF
15
30
5
15
mA
MAX
mA
MIN
μV
rms
mV/1000
hr
dB
MIN
0.2
0.6
26
V
MAX
V
MIN
500
20
80
0.05
0.3
33
55
0.2
0.6
26
500
20
80
0.05
0.3
33
70
−30
−80
60
−15
−50
70
−30
−80
50
−15
−50
V
MIN
V
MIN
V
MIN
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device
beyond its rated operating conditions.
Note 2:
See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
Note 3:
All limits are guaranteed for T
J
= 25°C (standard type face) or over the full operating junction temperature range of −40°C to +125°C (bold type face).
Note 4:
The maximum power dissipation is a function of maximum junction temperature T
Jmax
, total thermal resistance
θ
JA
, and ambient temperature T
A
. The
maximum allowable power dissipation at any ambient temperature is P
D
= (T
Jmax
− T
A
)/θ
JA
. If this dissipation is exceeded, the die temperature will rise above
150°C and the LM2931 will go into thermal shutdown. For the LM2931 in the TO-92 package,
θ
JA
is 195°C/W; in the SO-8 package,
θ
JA
is 160°C/W, and in the
TO-220 package,
θ
JA
is 50°C/W; in the TO-263 package,
θ
JA
is 73°C/W; and in the 6-Bump micro SMD package
θ
JA
is 290°C/W. If the TO-220 package is used
with a heat sink,
θ
JA
is the sum of the package thermal resistance junction-to-case of 3°C/W and the thermal resistance added by the heat sink and thermal
interface.
If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package: Using 0.5
square inches of copper area,
θ
JA
is 50°C/W; with 1 square inch of copper area,
θ
JA
is 37°C/W; and with 1.6 or more square inches of copper area,
θ
JA
is 32°C/
W.
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