Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. 63Sn/37Pb EUTECTIC BUMP
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION REMAINING PINS ARE NUMBERED
COUNTERCLOCKWISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X IS PACKAGE WIDTH, X IS PACKAGE LENGTH AND X IS
1
2
3
PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
8-Bump micro SMD
NS Package Number BPA08AAB
X1 = 1.285 X2 = 1.285 X3 = 0.850
www.national.com
24
NSC [ National Semiconductor ]
