The Die Attach Pad (DAP) can and should be connected to
PCB Ground plane/island. For CAD and assembly guide-
lines refer to Application Note AN-1187 at http://
power.national.com.
Application Information (Continued)
When using the adjustable version, special care must be
taken as to the location of the feedback resistors and the
associated wiring. Physically locate both resistors near the
IC, and route the wiring away from the inductor, especially an
open core type of inductor.
LLP PACKAGE DEVICES
The LM2675 is offered in the 16 lead LLP surface mount
package to allow for increased power dissipation compared
to the SO-8 and DIP.
23
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