Application Hints (Continued)
TABLE 1. θJA Different Heatsink Area (Continued)
Layout
10
Copper Area
Thermal Resistance
0
0.8
1
57
57
89
72
61
55
53
11
0
12
0.066
0.175
0.284
0.392
0.5
0.066
0.175
0.284
0.392
0.5
13
14
15
16
*
Note: Tab of device attached to topside of copper.
00906361
FIGURE 9. θJA vs 2oz Copper Area for TO-252
00906363
FIGURE 10. Maximum Allowable Power Dissipation vs. Ambient Temperature for TO-252
11
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