DS90C385/DS90C365 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display (FPD)
Link-85 MHz, +3.3V Programmable LVDS Transmitter 18-Bit Flat Panel Display (FPD) Link-85 MHz
May 2003
DS90C385/DS90C365
+3.3V Programmable LVDS Transmitter 24-Bit Flat Panel
Display (FPD) Link-85 MHz, +3.3V Programmable LVDS
Transmitter 18-Bit Flat Panel Display (FPD) Link-85 MHz
General Description
The DS90C385 transmitter converts 28 bits of LVCMOS/
LVTTL data into four LVDS (Low Voltage Differential Signal-
ing) data streams. A phase-locked transmit clock is transmit-
ted in parallel with the data streams over a fifth LVDS link.
Every cycle of the transmit clock 28 bits of input data are
sampled and transmitted. At a transmit clock frequency of 85
MHz, 24 bits of RGB data and 3 bits of LCD timing and
control data (FPLINE, FPFRAME, DRDY) are transmitted at
a rate of 595 Mbps per LVDS data channel. Using a 85 MHz
clock, the data throughput is 297.5 Mbytes/sec. Also avail-
able is the DS90C365 that converts 21 bits of LVCMOS/
LVTTL data into three LVDS (Low Voltage Differential Sig-
naling) data streams. Both transmitters can be programmed
for Rising edge strobe or Falling edge strobe through a
dedicated pin. A Rising edge or Falling edge strobe transmit-
ter will interoperate with a Falling edge strobe Receiver
(DS90CF386/DS90CF366) without any translation logic.
The DS90C385 is also offered in a 64 ball, 0.8mm fine pitch
ball grid array (FBGA) package which provides a 44 %
reduction in PCB footprint compared to the TSSOP package.
This chipset is an ideal means to solve EMI and cable size
problems associated with wide, high-speed TTL interfaces.
Features
n
20 to 85 MHz shift clock support
n
Best–in–Class Set & Hold Times on TxINPUTs
n
Tx power consumption
<
130 mW (typ)
@
85MHz
Grayscale
n
Tx Power-down mode
<
200µW (max)
n
Supports VGA, SVGA, XGA and Dual Pixel SXGA.
n
Narrow bus reduces cable size and cost
n
Up to 2.38 Gbps throughput
n
Up to 297.5 Megabytes/sec bandwidth
n
345 mV (typ) swing LVDS devices for low EMI
n
PLL requires no external components
n
Compatible with TIA/EIA-644 LVDS standard
n
Low profile 56-lead or 48-lead TSSOP package
n
DS90C385 also available in a 64 ball, 0.8mm fine pitch
ball grid array (FBGA) package
Block Diagrams
DS90C385
DS90C365
10086801
10086829
Order Number DS90C385MTD or DS90C385SLC
See NS Package Number MTD56 or SLC64A
Order Number DS90C365MTD
See NS Package Number MTD48
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© 2003 National Semiconductor Corporation
DS100868
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