Absolute Maximum Ratings (Note 1)
ESD (Note 2)
≥2000V
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Recommended Operating
Conditions
Case Temperature (TC)
Military
Above which the useful life may be impaired.
Storage Temperature (TSTG
)
−65˚C to +150˚C
−55˚C to +125˚C
−5.7V to −4.2V
Maximum Junction Temperature (TJ)
Ceramic
Supply Voltage (VEE
)
+175˚C
−7.0V to +0.5V
VEE to +0.5V
−50 mA
Note 1: Absolute maximum ratings are those values beyond which the de-
vice may be damaged or have its useful life impaired. Functional operation
under these conditions is not implied.
VEE Pin Potential to Ground Pin
Input Voltage (DC)
Note 2: ESD testing conforms to MIL-STD-883, Method 3015.
Output Current (DC Output HIGH)
Military Version
DC Electrical Characteristics
=
=
=
=
VEE −4.2V to −5.7V, VCC VCCA GND, TC −55˚C to +125˚C
Symbol
Parameter
Min
Max Units
TC
Conditions
Notes
VOH
Output HIGH Voltage −1025 −870
−1085 −870
mV
mV
mV
mV
mV
mV
mV
mV
mV
0˚C to +125˚C
−55˚C
(Notes 3, 4, 5)
=
VIN VIH (Max)
Loading with
VOL
VOHC
VOLC
VIH
VIL
Output LOW Voltage −1830 −1620
−1830 −1555
0˚C to +125˚C
−55˚C
or VIL (Min)
50Ω to −2.0V
Output HIGH Voltage −1035
−1085
0˚C to +125˚C
−55˚C
(Notes 3, 4, 5)
=
VIN VIH (Max)
Loading with
Output LOW Voltage
Input HIGH Voltage
Input HIGH Voltage
Input LOW Current
Input HIGH Current
−1610
−1555
0˚C to +125˚C
−55˚C
or VIL (Min)
50Ω to −2.0V
−1165 −870
−55˚C to +125˚C
Guaranteed HIGH Signal
for All Inputs
(Notes 3, 4, 5,
6)
−1830 −1475
0.50
mV
µA
−55˚C to +125˚C
−55˚C to +125˚
Guaranteed LOW Signal
for All Inputs
(Notes 3, 4, 5,
6)
=
VEE −4.2V
IIL
(Notes 3, 4, 5)
=
VIN VIL (Min)
=
VEE −5.7V
IIH
240
340
µA
µA
0˚C to +125˚C
−55˚C
(Notes 3, 4, 5)
(Notes 3, 4, 5)
=
VIN VIH (Max)
IEE
Power Supply
Current
−70
−25
mA
−55˚C to +125˚C
Inputs Open
Note 3: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals −55˚C), then testing immediately
without allowing for the junction temperature to stabilize due to heat dissipation after power-up. This provides “cold start” specs which can be considered a worst case
condition at cold temperatures.
Note 4: Screen tested 100% on each device at −55˚C, +25˚C, and +125˚C, Subgroups 1, 2, 3, 7, and 8.
Note 5: Sample tested (Method 5005, Table I) on each manufactured lot at −55˚C, +25˚C, and +125˚C, Subgroups A1, 2, 3, 7, and 8.
Note 6: Guaranteed by applying specified input condition and testing V /V
.
OH OL
AC Electrical Characteristics
=
=
=
VEE −4.2V to −5.7V, VCC VCCA GND
=
=
=
Symbol
Parameter
TC −55˚C
TC +25˚C
TC +125˚C
Units
ns
Conditions
Notes
Min
Max
Min
Max
Min
Max
tPLH
tPHL
tTLH
tTHL
Propagation Delay
Data to Output
0.30
1.80
0.40
1.60
0.40
1.80
(Notes 7, 8,
9, 11)
Figures 1, 2
Transition Time
0.30
1.20
0.30
1.20
0.30
1.20
ns
(Note 10)
20% to 80%, 80% to
20%
Note 7: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals −55˚C), then testing immediately
after power-up. This provides “cold start” specs which can be considered a worst case condition at cold temperatures.
Note 8: Screen tested 100% on each device at +25˚C, only Subgroup A9.
Note 9: Sample tested (Method 5005, Table I) on each manufactured lot at +25˚C, Subgroup A9, and at +125˚C and −55˚C temperatures, Subgroups A10 and A11.
3
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