CF5746 Series
PAD DIMENSIONS
L ayout
No.
A (ex. BCA)
10
9
1
2
8
Dimensions (µm)
X
166
166
166
166
444
1444
1444
1444
1444
1192
Y
1210
882
474
228
169
169
513
1219
1516
1531
B (BCA)
VSS
VDD
AI/SNZ
AO1
AO2
OUT1
OUT2
TEST
XT
XT
1
2
3
4
5
6
VDD
VSS
OUT1
AI/SNZ
TEST
OUT2
AO (AO1)
AO (AO2)
XT
XT
3
Y
4
(0, 0)
X
5
7
6
7
8
9
10
Chip size: 1.61
×
1.70 mm
Chip thickness: 400 ± 30 µm
Pad size: 100
×
100 µm
Chip surface is at V
DD
potential.
BLOCK DIAGRAM
TEST
VDD
VSS
XT
XT
C
D
4- Stage
Divider
11- Stage
Divider
Output
Control
OUT1
OUT2
AO Duty
Control
AO(AO1)
AO(AO2)
4- Stage
Divider
Alarm
Out
Snooze
Counter
Input
Control
AI/SNZ
NIPPON PRECISION CIRCUITS—2