CF5036 series
PAD LAYOUT
(Unit: µm)
OUT OUTN VCC2 OE
(1100,1300)
8
7
6
5
9
TEST
(0,0)
Y
DB5036
1
2
3
4
VCC
XIN XOUT GND
X
Chip size: 1.10 × 1.30mm
Chip thickness: 300 30ꢀm
PAD size: 150ꢀm × 100ꢀm (VCC, OUT, OUTN pins)
100ꢀm × 100ꢀm (excluding VCC, OUT, OUTN pins)
Chip base: GND potential
Note: The TEST pin is not used during normal operation.
PIN DESCRIPTION and PAD DIMENSIONS
Pad dimensions [µm]
Pad No.
Name
I/O
Function
X
Y
1
2
3
4
VCC
XIN
–
I
(+) supply pin
160
511
740
965
130
130
130
130
Oscillator input pin
Oscillator output pin
(–) ground pin
XOUT
GND
O
–
Output enable pin. Outputs are high impedance when LOW (oscillator
stopped). Power-saving pull-up resistor built-in.
5
OE
I
896
1170
6
7
8
9
VCC2
OUTN
OUT
–
O
O
I
(+) output buffer supply pin
756
523
244
136
1170
1170
1170
678
Output pin (complementary)
Output pin (true)
TEST
IC test pin. Leave open circuit for normal operation.
SEIKO NPC CORPORATION —2
NPC [ NIPPON PRECISION CIRCUITS INC ]
