CF5034 series
PAD LAYOUT
(Unit: µm)
OUTN
8
OUT
9
TEST
VCC2 OE
(1160,1310)
DA5034
7
6
5
Y
1
2
3
4
(0,0)
VCC
XIN XOUT GND
X
Chip size: 1.16
×
1.31mm
Chip thickness: 300 ± 30µm
Chip base: GND potential
PAD DESCRIPTION AND DIMENSIONS
Pad dimensions [µm]
Pad No.
1
2
3
4
5
6
7
8
9
Name
VCC
XIN
XOUT
GND
OE
TEST
VCC2
OUTN
OUT
I/O
–
I
O
–
I
I
–
O
O
Supply pin
Oscillator input pin
Oscillator output pin
Ground pin
Output enable pin. Outputs are high impedance when LOW (oscillator
stopped). Power-saving pull-up resistor built-in.
IC test pin. Leave open circuit for normal operation.
Output buffer supply pin
Output pin (complementary)
Output pin (true)
Function
X
146
536
809
1015
979
839
690
449
216
Y
145
145
145
145
1165
1165
1165
1165
1165
BLOCK DIAGRAM
OE
VCC2
VCC
R
f
1/2
ECL
OUT
OUTN
XIN
C
XIN
C
XOUT
GND
XOUT
NIPPON PRECISION CIRCUITS INC.—2
NPC [ NIPPON PRECISION CIRCUITS INC ]
