WF5027 series
VERSION DISCRIMINATION INTERNAL COMPONENTS
The WF5027 series device version is not determined solely by the mask pattern, but can also be determined by
the trimming of internal trimming fuses.
ꢀ Version determined by laser trimming:
These chips are produced from a common device by the laser trimming of fuses corresponding to the ordered
version, shown in table 1. These devices are shipped for electrical characteristics testing. Laser-trimmed ver-
sions are identified externally by the combination of the version name marking (1) and the locations of
trimmed fuses (2).
ꢀ Version determined by mask pattern:
These chips are fabricated using the mask corresponding to the ordered version, and do not require trimming.
Mask-fabricated versions are identified externally by the version name marking (1) only.
Since the WF5027 series devices are manufactured using 2 methods, there are 2 types of IC chip available
(identified externally) for the same version name. The identification markings for all WF5027 series device
versions is shown in table 2.
(750,690)
(1) Version code on die
NPC
(2) Trimming fuses
F1
F2
F3
F4
F5
F6
F7
F8
F9
SEIKO NPC CORPORATION —4