WF5027 series
SERIES CONFIGURATION
For Fundamental Oscillator
*2
Operating
Output drive
supply
voltage range
[V]
Recommended
Version
oscillation
frequency range
[MHz]
capability
[mA]
PAD layout
*1
f
f /2
O
output
f /32
O
output
f /64
O
output
f /4
O
output
f /8
O
output
f /16
O
output
O
output
20 to 60
60 to 100
20 to 60
60 to 100
20 to 60
60 to 100
5027A1 5027A2 5027A3 5027A4 5027A5 5027A6 5027A7
5027AP 5027AQ 5027AR 5027AS 5027AT 5027AV 5027AW
5027B1 5027B2 5027B3 5027B4 5027B5 5027B6 5027B7
5027BP 5027BQ 5027BR 5027BS 5027BT 5027BV 5027BW
5027C1 5027C2 5027C3 5027C4 5027C5 5027C6 5027C7
5027CP 5027CQ 5027CR 5027CS 5027CT 5027CV 5027CW
Flip Chip
Bonding
Wire Bonding
Type I
1.60 to 3.63
4
Wire Bonding
Type II
*1. The recommended oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscilla-
tion frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the
oscillation characteristics of components must be carefully evaluated.
*2. Wafer form devices have designation WF5027×× and chip form devices have designation CF5027××.
For 3rd Overtone Oscillator
*1
*2
Operating
supply
voltage range
[V]
Recommended oscillation frequency range [MHz] and version
Output drive
capability
[mA]
PAD layout
65 to 85
85 to 110 110 to 145
145 to 180
40 to 50
50 to 65
Flip Chip Bonding
Wire Bonding Type I
Wire Bonding Type II
5027MA
5027NA
5027PA
5027MB
5027NB
5027PB
5027MC
5027NC
5027PC
5027MD
5027ND
5027PD
(5027QE) (5027QF)
(5027RE) (5027RF)
1.60 to 3.63
8
(5027SE)
(5027SF)
*1. The recommended oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscilla-
tion frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the
oscillation characteristics of components must be carefully evaluated.
*2. Wafer form devices have designation WF5027×× and chip form devices have designation CF5027××.
Versions in parentheses ( ) are under development.
VERSION NAME
Device
Package
Version name
WF5027
−4
WF5027××–4
Wafer form
Form WF: Wafer form
CF: Chip (Die) form
Oscillation frequency range, frequency divider function
Pad layout type A, M, Q: for Flip Chip Bonding
B, N, R: for Wire Bonding (type I)
CF5027××–4
Chip form
C, P, S: for Wire Bonding (type II)
SEIKO NPC CORPORATION —2
NPC [ NIPPON PRECISION CIRCUITS INC ]
