CF5014 series
PAD LAYOUT
(Unit:
µ
m)
(720,680)
NPC
VDD
Y
HA
5014
Q
VSS
INHN
(0,0)
XT
X
XTN
Chip size: 0.72
×
0.68mm
Chip thickness: 220 ± 30µm
PAD size: 90µm
Chip base: V
DD
level
PIN DESCRIPTION and PAD DIMENSIONS
Pad dimensions [µm]
Name
I/O
Description
X
INHN
XT
XTN
VSS
Q
VDD
I
I
O
–
O
–
Output state control input. High impedance when LOW (oscillator stops).
Power-saving pull-up resistor built-in.
Amplifier input
Amplifier output
Ground
Output. Output frequency (f
O
, f
O
/2, f
O
/4, f
O
/8, f
O
/16) determined by internal connection
Supply voltage
Crystal connection pins.
Crystal is connected between XT and XTN.
151
238
512
588
588
131
Y
277
131
131
345
548
548
BLOCK DIAGRAM
VDD VSS
XTN
C
G
C
D
XT
R
f
1/2
1/2
1/2
1/2
Q
INHN
INHN = LOW active
NIPPON PRECISION CIRCUITS INC.—2
NPC [ NIPPON PRECISION CIRCUITS INC ]
