CF5008A1
PAD LAYOUT
(Unit : µm)
UNUSED2 VDD
(1400,1300)
INH
5
XT2
UNUSED1
1
2
3
4
8
7
6
(0,0)
VSS XT
Q
Chip size: 1.40
Chip thickness: 220 ± 30 µm
Chip base: V level
× 1.30 mm
DD
PAD DIMENSIONS
Pad dimens ions [µm]
Nu mb e r
Na me
I/O
Des cription
X
Y
1
2
3
4
UNUS ED1
UNUS ED2
XT2
–
–
Not used.
153
425
660
865
1112
1112
1112
1112
Not used.
O
–
Oscillator output pin
Supply voltage
VDD
Output-control input pin. Q signal output enabled when HIGH
or open. High-impedance output when LOW.
5
INH
I
1202
1112
6
7
8
Q
O
I
Output pin
1245
346
152
188
188
XT
Oscillator input pin
Ground
VS S
–
155
NIPPON PRECISION CIRCUITS—2
NPC [ NIPPON PRECISION CIRCUITS INC ]
