NJG1106KB2
n
PACKAGE OUTLINE (FLP6-B2)
0.75±0.05
2.0±0.1
+0.1
0.15-0.05
6
5
4
1
2
3
0.65
0.65
Lead material
: Copper
Lead surface finish
Molding material
UNIT
: Solder plating
: Epoxy resin
: mm
Weight
: 6.5mg
+0.1
0.2-0.05
[CAUTION]
Cautions on using this product
The specifications on this databook are only
given for information , without any guarantee
as regards either mistakes or omissions. The
application circuits in this databook are
described only to show representative usages
of the product and not intended for the
guarantee or permission of any right including
the industrial rights.
This product contains Gallium-Arsenide (GaAs) which is a harmful material.
· Do NOT eat or put into mouth.
· Do NOT dispose in fire or break up this product.
· Do NOT chemically make gas or powder with this product.
· To waste this product, please obey the relating law of your country.
This product may be damaged with electric static discharge (ESD) or spike voltage. Please
handle with care to avoid these damages.
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NJRC [ NEW JAPAN RADIO ]
