NICHIA STS-DA1-2009E <Cat.No.120828>
SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
Pre-heat
180 to 200°C
60sec Max
Above 220°C
120sec Max
260°C Max
10sec Max
●
Recommended Soldering Pad Pattern
0.4
0.5
1.3
1.2
3.3
0.5
(単½ Unit: mm)
4.1
* This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered,
Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
caused by heat and/or atmosphere.
* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.
Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and bump breaks, decreasing reliability.
When using automatic pick and place machine, use a pick up nozzle which does not directly apply stress
to the encapsulation of the LEDs.
Recommended conditions:
It is recommended to use a pick up nozzle designed for the LEDs. (See Figure below.)
* Avoid direct contact to the resin lens
with the picking up nozzle.
Failure to comply might result in catastrophic failure
of the LEDs due to bump damage or breakage.
0.4
3.5
4.5
(単½ Unit: mm)
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a hot plate should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
* The Die Heat Sink should be soldered to customer PCB.
If it is difficult or impossible, use high heat-dissipating adhesive.
* When soldering, do not apply stress to the LED while the LED is hot.
* This product uses an electrode pad design which improves thermal shock resistance.
After mounting, it is recommended to check if the solder fillets are properly formed on the sides of the pads.
1.9
6
NICHIA [ NICHIA CORPORATION ]
