NICHIA STS-DA1-1314D <Cat.No.110413>
SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
Pre-heat
180 to 200°C
60sec Max
Above 220°C
120sec Max
260°C Max
10sec Max
●
Recommended Soldering Pad Pattern
0.4
0.5
1.3
1.2
3.3
0.5
(単�½� Unit: mm)
4.1
* The product is designed to be reflow soldered to a PCB. If you use dip soldering or manual soldering for the products,
Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice.
* Care should be taken to avoid cooling at a rapid rate and ensure the peak temperature ramps down slowly.
* Customer is advised to use nitrogen reflow soldering as air flow process can cause optical degradation
due to the heat and atmosphere of reflow soldering.
* Since silicone used as encapsulating resin in this product is a soft material, do not press on the encapsulant.
Failure to comply might lead to nicks, chip-outs, delamination and deformation of the encapsulant, bump breakage
and an adverse effect on product reliability.
When using automatic pick and place machine, use a pick up nozzle which does not directly apply stress
to the encapsulation of the LEDs.
Recommended conditions:
It is recommended to use a pick up nozzle designed for the LEDs. (See Figure below.)
* Avoid direct contact to the resin lens
with the picking up nozzle.
Failure to comply might result in catastrophic failure
of the LEDs due to bump damage or breakage.
0.4
3
3.8
(単�½� Unit: mm)
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a hot plate should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
* The Die Heat Sink should be soldered to customer PCB.
If it is difficult or impossible, use high heat-dissipating adhesive.
* When soldering, avoid applying any stress to the LED package while heated.
1.9
5
NICHIA [ NICHIA CORPORATION ]
