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NSSW157BT 参数 Datasheet PDF下载

NSSW157BT图片预览
型号: NSSW157BT
PDF下载: 下载PDF文件 查看货源
内容描述: 无铅回流焊接的应用,内置ESD保护器件 [Pb-free Reflow Soldering Application, Built-in ESD Protection Device]
分类和应用:
文件页数/大小: 17 页 / 270 K
品牌: NICHIA [ NICHIA CORPORATION ]
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NICHIA STS-DA1-2682A <Cat.No.130306>
SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
Pre-heat
180 to 200°C
60sec Max
Above 220°C
120sec Max
• Recommended Hand Soldering Condition
Temperature
350°C Max
3sec Max
Soldering Time
260°C Max
10sec Max
Recommended Soldering Pad Pattern
Recommended Metal Solder Stencil Aperture
0.8
2.4
0.8
0.66
0.86
0.86
1.55
0.6
1.66
0.5
0.64
0.6
0.6
1.56
0.7
0.54
0.6
(単½ Unit: mm)
* This LED is designed to be reflow soldered on to a PCB. If dip soldered, Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
caused by heat and/or atmosphere.
* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.
Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability.
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
* When soldering, do not apply stress to the LED while the LED is hot.
1.55
5