欢迎访问ic37.com |
会员登录 免费注册
发布采购

NSSM016DT 参数 Datasheet PDF下载

NSSM016DT图片预览
型号: NSSM016DT
PDF下载: 下载PDF文件 查看货源
内容描述: 型号全彩LED [TYPE FULL COLOR LED]
分类和应用:
文件页数/大小: 13 页 / 431 K
品牌: NICHIA [ NICHIA CORPORATION ]
 浏览型号NSSM016DT的Datasheet PDF文件第2页浏览型号NSSM016DT的Datasheet PDF文件第3页浏览型号NSSM016DT的Datasheet PDF文件第4页浏览型号NSSM016DT的Datasheet PDF文件第5页浏览型号NSSM016DT的Datasheet PDF文件第7页浏览型号NSSM016DT的Datasheet PDF文件第8页浏览型号NSSM016DT的Datasheet PDF文件第9页浏览型号NSSM016DT的Datasheet PDF文件第10页  
Nichia
STSE-CM6126B
<Cat.No.070227>
(4) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Pre-heat
Pre-heat time
Peak
temperature
Soldering time
Condition
Reflow Soldering
Lead Solder
Lead-free Solder
180
~
200°C
120
~
150°C
120 sec. Max.
120 sec. Max.
240°C Max.
260°C Max.
10 sec. Max.
10 sec. Max.
refer to
refer to
Temperature - profile
1
. Temperature - profile
2
.
(N
2
reflow is recommended.)
Hand Soldering
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
Although the recommended soldering conditions are specified in the above table, reflow or hand
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile
(Surface of circuit board)]
Use the conditions shown to the under figure.
<
1
: Lead Solder>
<
2
: Lead-free Solder>
2.5 ~ 5°C / sec.
Pre-heating
120 ~ 150°C
60sec.Max.
Above 200
°C
120sec.Max.
240°C Max.
10sec. Max.
1 ~ 5°C / sec.
1 ~ 5°C / sec.
Pre-heating
180 ~ 200°C
60sec.Max.
Above 220°C
260°C Max.
10sec. Max.
2.5 ~ 5°C / sec.
120sec.Max.
[Recommended soldering pad design]
1.7
Use the following conditions shown in the figure.
1.7
1.4
5.6
3
2.75
8.75
3
(Unit : mm)
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow.
It is recommended that the User use the nitrogen reflow method.
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
(5) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.
When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic.
When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
-5-