Nichia STS-DA1-0157
<Cat.No.080331>
(4) Static Electricity
· Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions
be taken against surge voltage to the equipment that mounts the LEDs.
· When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not.
It is easy to find
static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended).
· Damaged LEDs will show some unusual characteristics such as the leak current remarkably
increases, the forward voltage becomes lower, or the LEDs do not light at the low current.
Criteria : (V
F
> 2.0V at I
F
=0.5mA)
(5) Soldering Conditions
· Nichia LED leadframes are silver plated copper alloy.
This substance has a low
thermal coefficient (easily conducts heat).
Careful attention should be paid during soldering.
· Solder the LED no closer than 3mm from the base of the epoxy bulb.
Soldering beyond the base
of the tie bar is recommended.
· Recommended soldering conditions
Dip Soldering
Pre-Heat
Pre-Heat Time
Solder Bath
Temperature
Dipping Time
Dipping Position
10 seconds Max.
No lower than 3 mm from the
base of the epoxy bulb.
120°C Max.
60 seconds Max.
260°C Max.
Temperature
Soldering Time
Position
Hand Soldering
350°C Max.
3 seconds Max.
No closer than 3 mm from the
base of the epoxy bulb.
· Although the recommended soldering conditions are specified in the above table, dip or hand
soldering at the lowest possible temperature is desirable for the LEDs.
· A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
· Dip soldering should not be done more than one time.
· Hand soldering should not be done more than one time.
· Do not apply any stress to the lead particularly when heated.
· The LEDs must not be repositioned after soldering.
· After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until
the LEDs return to room temperature.
· Direct soldering onto a PC board should be avoided.
Mechanical stress to the resin may be caused
from warping of the PC board or from the clinching and cutting of the leadframes.
When it is
absolutely necessary, the LEDs may be mounted in this fashion but the User will assume responsibility
for any problems.
Direct soldering should only be done after testing has confirmed that no damage,
such as wire bond failure or resin deterioration, will occur.
Nichia’s LEDs should not be soldered
directly to double sided PC boards because the heat will deteriorate the epoxy resin.
· When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize
the mechanical stress on the LEDs.
· Cut the LED leadframes at room temperature.
Cutting the leadframes at high temperatures may
cause failure of the LEDs.
-5-
NICHIA [ NICHIA CORPORATION ]
