Nichia STSE-CL6143A
<Cat.No.061228>
(3) Soldering Conditions
· Nichia LEDs uses a copper alloy lead frame which provides a high thermal conductivity.
Thermal
stress such as soldering heat may reduce the reliability of the product; particular caution should be
used to avoid damage prior to and during soldering.
The recommended soldering conditions are
listed in the following table.
· Solder the LED no closer than 1.6mm from the base of the stopper.
· The mechanical stress by clinching will cause degradation of the reliability on the LEDs. It is
important to minimize the mechanical stress on the LEDs.
It should be confirmed beforehand
that it will not cause any problem when using it.
· Recommended soldering conditions
Pre-Heat
Pre-Heat Time
Solder Bath
Temperature
Dipping Time
Dipping Position
Dip Soldering
120°C Max.
60 seconds Max.
260°C Max.
5 seconds Max.
No lower than 1.6 mm from the
base of the stopper.
Hand Soldering
350°C Max.
Temperature
3 seconds Max.
Soldering Time
No closer than 1.6 mm from the
Position
base of the stopper.
· Although the recommended soldering conditions are specified in the above table, dip or hand
soldering at the lowest possible temperature is desirable for the LEDs.
· A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
· Dip soldering should not be done more than one time.
· Hand soldering should not be done more than one time.
· Do not apply any stress to the lead particularly when heated.
· The LEDs must not be repositioned after soldering.
· After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until
the LEDs return to room temperature.
· Direct soldering onto a PC board should be avoided.
Mechanical stress to the resin may be caused
from warping of the PC board or from the clinching and cutting of the leadframes.
When it is
absolutely necessary, the LEDs may be mounted in this fashion but the User will assume responsibility
for any problems.
Direct soldering should only be done after testing has confirmed that no damage,
such as wire bond failure or resin deterioration, will occur.
Nichia’s LEDs should not be soldered
directly to double sided PC boards because the heat will deteriorate the epoxy resin.
· When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize
the mechanical stress on the LEDs.
· Cut the LED leadframes at room temperature.
Cutting the leadframes at high temperatures may
cause failure of the LEDs.
(4) Heat Generation
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED
placement on the board, as well as other components. It is necessary to avoid intense heat generation
and operate within the maximum ratings given in this specification.
· The operating current should be decided after considering the ambient maximum temperature of LEDs.
-5-
NICHIA [ NICHIA CORPORATION ]
