Nichia STS-DA1-0770
<Cat.No.090427>
(6) Soldering Conditions
· Solder the LED no closer than 3mm from the base of the lead.
· Recommended soldering conditions
Dip Soldering
Pre-Heat
Pre-Heat Time
Solder Bath
Temperature
Dipping Time
Dipping Position
10 seconds Max.
No lower than 3 mm from the
base of the lead.
120°C Max.
60 seconds Max.
260°C Max.
Temperature
Soldering Time
Position
Hand Soldering
350°C Max.
3 seconds Max.
No closer than 3 mm from the
base of the lead.
· Although the recommended soldering conditions are specified in the above table, dip or hand
soldering at the lowest possible temperature is desirable for the LEDs.
· A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
· Dip soldering should not be done more than one time.
· Hand soldering should not be done more than one time.
· Do not apply any stress to the lead particularly when heated.
· The LEDs must not be repositioned after soldering.
· After soldering the LEDs, the lead should be protected from mechanical shock or vibration until
the LEDs return to room temperature.
· Direct soldering onto a PC board should be avoided.
Mechanical stress to the resin may be caused
from warping of the PC board or from the clinching and cutting of the leadframes.
When it is
absolutely necessary, the LEDs may be mounted in this fashion but the customer will assume
responsibility for any problems.
Direct soldering should only be done after testing has confirmed that
no damage, such as wire bond failure or resin deterioration, will occur.
Nichia’s LEDs should not be
soldered directly to double sided PC boards because the heat will deteriorate the epoxy resin.
· When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize
the mechanical stress on the LEDs.
· Cut the LED leads at room temperature.
Cutting the leads at high temperatures may
cause failure of the LEDs.
(7) Heat Generation
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
· The operating current should be decided after considering the ambient maximum temperature of LEDs.
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NICHIA [ NICHIA CORPORATION ]
