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NJSE036AT 参数 Datasheet PDF下载

NJSE036AT图片预览
型号: NJSE036AT
PDF下载: 下载PDF文件 查看货源
内容描述: 蓝绿色LED [BLUISH-GREEN LED]
分类和应用:
文件页数/大小: 15 页 / 608 K
品牌: NICHIA [ NICHIA CORPORATION ]
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Nichia STS-DA1-0227  
<Cat.No.080613>  
(6) Soldering Conditions  
· The LEDs can be soldered in place using the reflow soldering method.  
Nichia cannot make a  
guarantee on the LEDs after they have been assembled using the dip soldering method.  
· Recommended soldering conditions  
Reflow Soldering  
Lead Solder  
120 ~ 150°C  
Hand Soldering  
Lead-free Solder  
180 ~ 200°C  
Pre-heat  
Temperature  
350°C Max.  
Pre-heat time  
Peak  
Soldering time 3 sec. Max.  
(one time only)  
120 sec. Max.  
240°C Max.  
120 sec. Max.  
260°C Max.  
temperature  
Soldering time  
Condition  
10 sec. Max.  
refer to  
10 sec. Max.  
refer to  
Temperature - profile 1. Temperature - profile 2.  
(N2 reflow is recommended.)  
Although the recommended soldering conditions are specified in the above table, reflow or hand  
soldering at the lowest possible temperature is desirable for the LEDs.  
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.  
[Temperature-profile (Surface of circuit board)]  
Use the conditions shown to the under figure.  
<2 : Lead-free Solder>  
<1 : Lead Solder>  
2.5 ~ 5°C / sec.  
240°C Max.  
1 ~ 5°C / sec.  
260°C Max.  
10sec. Max.  
10sec. Max.  
Pre-heating  
Pre-heating  
1 ~ 5°C / sec.  
180 ~ 200°C  
2.5 ~ 5°C / sec.  
120 ~ 150°C  
60sec.Max.  
60sec.Max.  
Above 220°C  
Above 200°C  
120sec.Max.  
120sec.Max.  
[Recommended soldering pad design]  
Use the following conditions shown in the figure.  
4.1  
0.6  
(Unit : mm)  
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere  
during air reflow. It is recommended that the User use the nitrogen reflow method.  
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the  
top of package. The pressure to the top surface will be influence to the reliability of the LEDs.  
Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using  
the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.  
· Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,  
a double-head soldering iron should be used. It should be confirmed beforehand whether the  
characteristics of the LEDs will or will not be damaged by repairing.  
· Reflow soldering should not be done more than two times.  
· When soldering, do not put stress on the LEDs during heating.  
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